The Department of Geology has a full suite of sawing, grinding, and polishing equipment necessary for making polished thin sections including:
- Highland Park J-3 Slab Saw
- Makita MK 101 Tile Saw (for trimming)
- Lortone Trim Saw
- Buehler Petro-Thin Thin Sectioning System
- Buehler Isomet Low-Speed Saw
- Buehler Minimet Polisher
- Buehler Vacuum Impregnator
- Buehler Ecomet II
- Buehler Handimet II
- Logitech CL50 Compact Lapping/Polishing Machine
For Help in making thin sections, see the department technician.